0510-81135862
| Document Number | Content |
|---|---|
| JESD22-A100 | Cycled Temperature-Humidity-Bias Life Test |
| JESD22-A101 | Steady State Temperature Humidity Bias Life Test |
| JESD22-A102 | Accelerated Moisture Resistance - Unbiased Autoclave |
| JESD22-A103 | High Temperature Storage Life |
| JESD22-A104 | Temperature Cycling |
| JESD22-A105 | Power and Temperature Cycling |
| JESD22-A106 | Thermal Shock |
| JESD22-A107 | Salt Atmosphere |
| JESD22-A108 | Temperature, Bias, and Operating Life |
| JESD22-A110 | Highly-Accelerated Temperature and Humidity Stress Test (HAST) |
| JESD22-A113 | Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing |
| JESD22-A115 | Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM) |
| JESD22-A117 | ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST |
| JESD22-A118 | Accelerated Moisture Resistance -Unbiased HAST |
| JESD22-A119 | Low Temperature Storage Life |
| JESD22-B101 | External Visual |
| JESD22-B102 | Solderability |
| JESD22-B103 | Vibration, Variable Frequency |
| JESD22-B106 | Resistance to Solder Shock for Through-Hole Mounted Devices |
| JESD22-B110 | Mechanical Shock - Compont and Subassembly |
| JESD22-B111 | Board Level Drop Test Method of Components for Handheld Electronic Products |
| JESD22-B113 | Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products |
| IPC/JEDEC J-STD-002 | Solderability Test for Component Leads, Terminations, Lugs, Terminals and Wires |
| IPC/JEDEC J-STD-020 | Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices |
| ANSI/ESDA/JEDEC JS-001 | Human Body Model (HBM) - Component Level |
| ANSI/ESDA/JEDEC JS-002 | Charged Device Model (CDM) – Device Level |
| JEP122 | Failure Mechanisms and Models for Semiconductor Devices |
| JESD47 | Stress-Test-Driven Qualification of Integrated Circuits |
| JESD74 | Early Life Failure Rate Calculation Procedure for Semiconductor Components |
| JESD78 | IC Latch-Up Test |
| JESD226 | RF BIASED LIFE (RFBL) TEST METHOD |
| Document Number | Content |
|---|---|
| AEC-Q100 | Stress Qualification For Integrated Circuits (with test methods) |
| AEC-Q101 | Stress Test Qualification For Discrete Semiconductors |
| AEC-Q200 | Stress Test Qualification For Passive Components (complete document with test methods) |
| AEC-Q005 | Pb-Free Test Requirement |
| AEC-Q006 | Qualification Requirements for Components using Copper Wire Interconnections |
| Document Number | Content |
|---|---|
| IEC 60068 | Environmental testing |
| IEC 60747 | Semiconductor devices |
| IEC 60749 | Semiconductor devices－Mechanical and climate test methods |
| IEC 60810 | Lamps for road vehicles – Performance requirements |
